MUNICH, GERMANY: Besides its existing product portfolio of solution-processable semiconductor, dielectric and auxiliary material inks which allow manufacturing organic thin film transistors (OTFT) on flexible substrates in a cost-efficient way, BASF New Business GmbH presents its new InkSet 1000SP package for fully structured transistors.
BASF New Business GmbH is a subsidiary of BASF SE.
“InkSet 1000SP is a comprehensive package which includes inks for planarization, contact treatment, semiconductor, gate dielectric and the interlayer dielectric, as well as a complete process description for their application. The inks and processes are perfectly adapted to each other,” said Dr Jochen Brill, head of R&D of BASF’s field effect transistor team.
“Our customers can directly use our InkSet 1000SP and apply it according to the process description to manufacture their own active matrix backplanes or circuitry, thus saving resources on process development,” added Brill.
Smart packaging demonstrator
Along with the products, BASF is also highlighting the benefits of flexible and lightweight electronics in various applications. The recent demonstrator built jointly by BASF and InnovationLab, Heidelberg, visualises the opportunities for Printed Organic Electronics in packaging.
An interactive label is an example of a marketing tool for a brand owner that adds a unique feature for consumers. This system can be applied to a variety of packaging, enabling the trend for increased interactivity.
Most parts of the demonstrator are printed: piezoresistive sensors and OTFTs – which means the fabrication is simple and cost efficient. The possibility to integrate printed circuits into continuous roll-to-roll processes, typical for label production, makes printed TFTs the solution of choice for the next generation of smart labels and packaging.
© Chemical Today News
Read More: BASF presents new inks for printed electronics
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